With Intel Rapid Start Technology the previous session resumes to the exact as it was, so that applications are still in the same state and no application data is lost.
GIGABYTE ULTRA DURABLE MOTHERBOARD LGA 1155 FULL
This means users will be able to experience almost zero power draw from their PC, but be able to resume Windows 7 is a few seconds without having the PC go through a full system boot. Intel Rapid Start Technology gets your device up and running faster from even the deepest sleep. 3.0 expansion bus, allowing users to take advantage of the next generation, high-bandwidth discrete graphics card solutions.* PCIE Gen.3 is dependent on CPU and expansion card compatibility. The 3rd generation Intel Core processor platform debuts the new PCI Express gen. GIGABYTE 7 series motherboards take advantage of the latest connectivity and expansion bus technologies available on the Intel platform. Based on the mature LGA 1155 socket, 3rd generation Intel Core processors feature up to four high-performance 64-bit processor cores and 8MB of 元 cache Smart Cache, and overall performance when you need it most. New 3rd generation Intel Core processors are based on the new 3rd generation Intel Core processor architecture, manufactured using the latest 22nm process to create a visually optimized processor platform. GIGABYTE uses All Solid Caps (Capacitors) and Low RDS(on) MOSFETs which are rated to work at higher temperatures, providing up to 50,000* hour component lifespan. GIGABYTE also uses Anti-Surge ICs to protect the motherboard against power surges. Permanent damage from power surge or failure during BIOS update, can be avoided with GIGABYTE DaulBIOS, which automatically enables a secondary, back up BIOS.
GIGABYTE Ultra Durable 4 Classic motherboards feature High Resistance ICs which help protect the motherboard against electrostatic discharge. Humidity can play havoc on a motherboard's circuitry.GIGABYTE's new Glass Fabric PCB design helps protect against electrical shorts due to humidity by reducing the gaps in spacing between PCB filaments.
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